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Mark your calendars!
Topic: Stencil Design Guidelines
and Technology Review
When: July 22th, 2009, 5 PM
to 8:30 PM
Where: Haywards BBQ
11051 S Antioch
Overland Park, KS 66210
(Click
HERE for directions)
Speaker: Richard Brooks holds degrees
in both Chemistry and Chemical Engineering from the University of
Florida and he has worked in the electronics industry for the past 20
years. He has experience with Motorola and Indium Corporation in
the areas of package size reduction, ultra-fine pitch solder paste
printing, flip-chip and soldering processes and will be focused on all
aspects of the printing process.
Description:
The presentation will review and discuss all aspects of the paste
printing process that utilize stencils to transport the solder paste
onto the printed circuit board; stencil technologies, aspect
ratios, IPC 7525 stencil design, SN/PB vs Pb-free, pin-in-hole and more.
Click
HERE
(pdf) for more details
RSVP: by Monday July 20th by
email
or phone (913) 469-1312 (email preferred)
** Door opens at 4:30 - come early and network!
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